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Innovation Direction of SMT equipment

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Nowadays, the consumption of electronic products tends to be more and more precise and skillful, resulting in the transformation, innovation and reform of the electronic manufacturing industry. Intelligent related products have gradually become a new driving force for the development of enterprises. At present, with the popularity of SMT mounting technology in society, various industries have set off to find a more unique way to replace the previous circuit board through hole plug technology upsurge.
 
The first generation placement machine does not have the function of visual recognition device, precision servo system, automatic feeding board and automatic nozzle changing, and only contains the step multi-axis system with low precision.
 
The second generation placement machine has visual recognition devices, the mounting head is expanded from two to more, and the automatic transmission and import servo technology XY axis system can also be introduced.
 
The third generation placement machine realizes higher level upgrade on the basis of the first two generations, the device identification and mount optimization function, the z axis height adopts the precision servo technology, satisfies the different device to the IC thickness detection and the replenishment, the high precision mounting and so on. In practical application, the third generation placement machine is more like a kind of precision industrial robot, which is composed of computer, precision machinery, optics, ball screw, driver, sensor, linear motor and vacuum system.
 
That is to say, using the high performance efficiency of SMT placement machine, focusing on the production line, realizing more precise and high speed automation equipment in the future, at the same time, the precision of equipment production line is the most key factor in SMT placement machine technology, and it is also the most demanding factor. The development trend can be simply summarized as high integration, high efficiency, high performance, diversification, intelligence and greening.