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Brief introduction of JUKI Machine (I)

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Operators in the operation of the JUKI placement machine mount production, the first should be on-the-job training, technical personnel should be proficient in various operational techniques, and in the operation process should and must be in accordance with the requirements of the training specifications to carry out the operation. The JUKI chip machine uses the suction mouth type to match the JUKI chip machine suction mouth, at the same time, the JUKI suction mouth according to the different materials absorbed and subdivided into many specifications, the following continue to introduce the production requirements specification:

Size settings:

In the production procedure of the ke2000 series, the position of the component and the mark on the substrate is represented by the coordinates, and the origin of the coordinate system on the substrate is called the "Base plate origin".

A. The origin of the substrate can be set at any position on or outside the substrate.

B. When making patch data with cad data, use the origin of cad data. At the same time, in the placement device of the element patch, the positioning hole reference is used to locate the substrate. According to the position of the positioning hole and the value of the offset set by the substrate, the relative position between the positioning system and the substrate "substrate origin" must be specified.

a. Benchmark differences due to the fixed mode of the substrate:

Due to positioning hole reference, shape reference, transmission direction, transmission reference and other factors, the determination methods of each benchmark are different.

Benchmark: the position of the reference pin is based on the transmission benchmark and direction. (positioning hole reference) the position of the end point of the substrate design: according to the reference and direction of transmission.

b. Single circuit board:

(I) Dimensions of the substrate: Enter the overall dimensions of the substrate. When the substrate is provided with the model, enter the dimension including the model base plate, the direction in the same direction as the conveying direction is X, and the direction at right angles to the conveying direction is Y;

(II) Location of the position of the hole: the position of the input from the origin of the substrate to the reference pin. (When the positioning mode is used as an outline reference in the basic setting, it is not necessary to set the project). When using the CAD data, if it is necessary to use the determined origin (the CAD origin or the origin of the enterprise unique origin) as the substrate origin, it is necessary to input the size from the origin of the substrate to the reference position determined by the CAD or the like, and when the transfer direction of the substrate is from left to right, the positioning hole on the left side is the reference. When there is a substrate origin in the lower left corner, the values of Xa, Ya (X, Y are positive values) are input in the X and Y coordinates of the position of the positioning hole, respectively.

Note: when the origin of the substrate is consistent with the reference position, enter (0, 0) in the X, Y coordinates of the positioning hole position;

(III) The substrate design offset: the position of the substrate end point determined at the substrate origin is input. When the CAD data is used, it is necessary to input the size of the origin of the substrate to the reference position (the substrate design end point) determined by the CAD or the like from the origin of the substrate to the reference position (the substrate design end point) when the decision origin (the cad origin or the origin of the enterprise specific origin) is used as the substrate origin. The position of the substrate end point determined at the substrate origin is input.

Note: In general, the center of the reference hole is in a position of about 5 mm from the substrate angle X, Y. Therefore, when the "Location of the location hole" and the origin of the substrate are the same, the difference between the origin of the substrate and the "substrate design endpoint" is X and Y is equal to 5 mm;

(IV) BOC marking position: enter the size from the origin of the substrate to the central position of each BOC tag to teach the marking shape. The BOC tag requires 2 or 3 points:

When 2 points are used: the difference between the design dimension and the actual dimension(measured dimension)and the error in the direction of rotation can be trimmed, leaving the third point blank. In addition, when there are multiple marks on the substrate, two points on the diagonal line shall be selected while considering the range of all patches;

When using 3 points: on the basis of 2 points, the teaching of X, Y coordinates can also be modified, otherwise all patch coordinates will deviate from the design value;

(V) Bad board marking position: single circuit board does not need to be set(cannot be set);

(VI) Height of the substrate: At this input, the height above the substrate as seen from the transport reference plane (the "0" position of the reference height, here the z-axis) is input, and therefore the "0.00" (initial value) is generally entered. Note: The height of the suction nozzle at the time of the patch (dropping) is determined by the height of the base plate. Therefore, if an error is set, the patch is scattered (the element will drop in the middle, or press the one-sided adhesive too much);

(VII) Substrate thickness: Input the substrate thickness, which is used to determine the height of the support when the substrate is centered;

(VIII) Back height: enter the height of the highest element in the patch element on the back of the substrate (the internal test element is not interfered with by the support pin on both sides of the patch). This value will determine the standby height at which the production is the support. If the value is too small, the production beat is accelerated due to the short moving distance of the support platform (the maximum difference between 5mm and 40mm is about 0.25 seconds).

Note: if you enter a value smaller than the backside element height, the support destroys the contact element when the substrate is transmitted, so be sure to enter a value larger than the backside element height.