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JUKI High-Speed Modular Mounter FX-3RA

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JUKI High-Speed Modular Mounter FX-3RA

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JUKI High-Speed Modular Mounter FX-3RA

High speed, high reliability modular mounter
Improve productivity, reduce rework
Designed to work with KE Series machines to form a high speed, flexible production line

Features

Chip

90,000CPH (0.040Sec. / chip / Optimum
66,000CPH (IPC9850)

0402mm(01005 inch) ~ 33.5mm×33.5mm

Laser recognition : ±0.05mm(±3σ)

On-the-fly centering using integrated laser

2 stations, 4 gantries, 4 placement heads, 24 nozzles

Linear servo motor XY drive with full closed-loop control

Holds up to 240 components

Electrical or mechanical feeder trolley

Specification

Item/Model

High-Speed Modular Mounter
FX-3RAL

High-Speed Modular Mounter
FX-3RAXL

Board size

L size(410x360mm)

yes

no

L-Wide size(510x360mm)*1

yes

no

XL size(610×560mm)

no

yes

Applicability to long PWB*1

800×360mm

800×560mm

Component height

6mm

yes

Component size

Laser recognition

0402(01005) ~ 33.5mm×33.5mm

Placement speed (chip)

Optimum

0.040Sec. / chip(90,000CPH)*2

IPC9850

66,000CPH*2

Placement accuracy

Laser recognition

±0.05mm(±3σ)

Feeder inputs

Max.240 in case of 8mm tape
(on a Electric double tape feeder)

*1 L-Wide size , Applicability to long PWB is optional.
*2 This speed does not apply to XL board size.

Features of the Laser Centering

JUKI’s original technology supports the high accuracy and high repeatability required for high density placement.

High-speed, on-the-fly centering

A high resolution laser is mounted on the head to center components in all directions including angle. Centering is done on-the-fly, allowing high speed placement of components from small chips to SOPs.

Adaptable centering

Centering accommodates component variations

Laser centering measures the components on the side. It is not affected by variations of component color or width/length so, unlike vision centering, there is no need to edit component data for different component vendors.

Component check function improves placement reliability

Since the laser is mounted on the head, it can be used to monitor the presence of components the entire time from pick to placement. This is difficult to accomplish with vacuum detection only. The placement reliability is also improved because the release of the component is confirmed after placement.