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JUKI High-Speed Modular Mounter FX-3RA
JUKI High-Speed Modular Mounter FX-3RA
High speed, high reliability modular mounter
Improve productivity, reduce rework
Designed to work with KE Series machines to form a high speed, flexible production line
Features
|
Chip |
90,000CPH (0.040Sec. / chip / Optimum） |
0402mm(01005 inch) ~ 33.5mm×33.5mm
Laser recognition : ±0.05mm(±3σ)
On-the-fly centering using integrated laser
2 stations, 4 gantries, 4 placement heads, 24 nozzles
Linear servo motor XY drive with full closed-loop control
Holds up to 240 components
Electrical or mechanical feeder trolley
Specification
|
Item/Model |
High-Speed Modular Mounter |
High-Speed Modular Mounter |
|
|
Board size |
L size(410x360mm) |
yes |
no |
|
L-Wide size(510x360mm)*1 |
yes |
no |
|
|
XL size(610×560mm) |
no |
yes |
|
|
Applicability to long PWB*1 |
800×360mm |
800×560mm |
|
|
Component height |
6mm |
yes |
|
|
Component size |
Laser recognition |
0402(01005) ~ 33.5mm×33.5mm |
|
|
Placement speed (chip) |
Optimum |
0.040Sec. / chip(90,000CPH)*2 |
|
|
IPC9850 |
66,000CPH*2 |
||
|
Placement accuracy |
Laser recognition |
±0.05mm(±3σ) |
|
|
Feeder inputs |
Max.240 in case of 8mm tape |
||
*1 L-Wide size , Applicability to long PWB is optional.
*2 This speed does not apply to XL board size.
Features of the Laser Centering
JUKI’s original technology supports the high accuracy and high repeatability required for high density placement.
High-speed, on-the-fly centering
A high resolution laser is mounted on the head to center components in all directions including angle. Centering is done on-the-fly, allowing high speed placement of components from small chips to SOPs.
Adaptable centering
Centering accommodates component variations
Laser centering measures the components on the side. It is not affected by variations of component color or width/length so, unlike vision centering, there is no need to edit component data for different component vendors.
Component check function improves placement reliability
Since the laser is mounted on the head, it can be used to monitor the presence of components the entire time from pick to placement. This is difficult to accomplish with vacuum detection only. The placement reliability is also improved because the release of the component is confirmed after placement.
